Thermal Conductive Diamond-Economical

Product introduction:

This product features a relatively regular crystalline form, low impurity content, and high particle concentration. It has high stability and a high thermal conductivity coefficient, making it a preferred cost-effective filler option.

Size Available: 0.02um-350um

Application:

  1. Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal putty and etc.