This product has a honeycomb structure, primarily used in precision grinding and polishing applications—including SiC, sapphire substrate wafers, optics, ceramics, and alloys—and serves as an alternative to polycrystalline diamond.

Available Particle Sizes: 1-3μm ~ 40-60μm

• Strong holding force
• High self-sharpening ability
• Efficient cutting performance
• Significantly reduces workpiece surface roughness